Crystalline-silicon reliability lessons for thin-film modules

The reliability of crystalline silicon modules has been brought to a high level with lifetimes approaching 20 years, and excellent industry credibility and user satisfaction. The transition from crystalline modules to thin film modules is comparable to the transition from discrete transistors to integrated circuits. New cell materials and monolithic structures will require new device processing techniques, but the package function and design will evolve to a lesser extent. Although there will be new encapsulants optimized to take advantage of the mechanical flexibility and low temperature processing features of thin films, the reliability and life degradation stresses and mechanisms will remain mostly unchanged. Key reliability technologies in common between crystalline and thin film modules include hot spot heating, galvanic and electrochemical corrosion, hail impact stresses, glass breakage, mechanical fatigue, photothermal degradation of encapsulants, operating temperature, moisture sorption, circuit design strategies, product safety issues, and the process required to achieve a reliable product from a laboratory prototype

An Algorithm for Synthesizing Mass and Stiffness Matrices from Experimental Vibration Modes

An algorithm is described for synthesizing the mass and stiffness matrices from experimentally derived modal data in a way that preserves the physical significance of the individual mass and stiffness elements. The mass and stiffness matrices are derived for a rollup solar array example, and are then used to define the modal response of a modified array

Long-term stability of amorphous-silicon modules

The Jet Propulsion Laboratory (JPL) program of developing qualification tests necessary for amorphous silicon modules, including appropriate accelerated environmental tests reveal degradation due to illumination. Data were given which showed the results of temperature-controlled field tests and accelerated tests in an environmental chamber

Electricity from photovoltaic solar cells: Flat-Plate Solar Array Project final report. Volume VI: Engineering sciences and reliability

The Flat-Plate Solar Array (FSA) Project, funded by the U.S. Government and managed by the Jet Propulsion Laboratory, was formed in 1975 to develop the module/array technology needed to attain widespread terrestrial use of photovoltaics by 1985. To accomplish this, the FSA Project established and managed an Industry, University, and Federal Government Team to perform the needed research and development. This volume of the series of final reports documenting the FSA Project deals with the Project's activities directed at developing the engineering technology base required to achieve modules that meet the functional, safety and reliability requirements of large-scale terrestrial photovoltaic systems applications. These activities included: (1) development of functional, safety, and reliability requirements for such applications; (2) development of the engineering analytical approaches, test techniques, and design solutions required to meet the requirements; (3) synthesis and procurement of candidate designs for test and evaluation; and (4) performance of extensive testing, evaluation, and failure analysis to define design shortfalls and, thus, areas requiring additional research and development. During the life of the FSA Project, these activities were known by and included a variety of evolving organizational titles: Design and Test, Large-Scale Procurements, Engineering, Engineering Sciences, Operations, Module Performance and Failure Analysis, and at the end of the Project, Reliability and Engineering Sciences. This volume provides both a summary of the approach and technical outcome of these activities and provides a complete Bibliography (Appendix A) of the published documentation covering the detailed accomplishments and technologies developed

RUSAP: A computer program for the calculation of Roll-Up Solar Array Performance characteristics

RUSAP is a FORTRAN 4 computer program designed to determine the performance characteristics (power-to-weight ratio, blanket tension, structural member section dimensions, and resonant frequencies) of large-area, roll-up solar arrays of the single-boom, tensioned-substrate design. The program includes the determination of the size and weight of the base structure supporting the boom and blanket and the determination of the blanket tension and deployable boom stiffness needed to achieve the minimum-weight design for a specified frequency for the first mode of vibration. A complete listing of the program, a description of the theoretical background, and all information necessary to use the program are provided

Parametric study of the performance characteristics and weight variations of large-area roll-up solar arrays

Performance characteristics and weight variations of large area, roll-up, solar array

Design and application of gas-gap heat switches

Gas-gap heat switches can serve as an effective means of thermally disconnecting a standby cryocooler when the primary (operating) cooler is connected and vice versa. The final phase of the development and test of a cryogenic heat switch designed for loads ranging from 2 watts at 8 K, to 100 watts at 80 K are described. Achieved heat-switch on/off conductance ratio ranged from 11,000 at 8 K to 2200 at 80 K. A particularly challenging element of heat-switch design is achieving satisfactory operation when large temperatures differentials exist across the switch. A special series of tests and analyses was conducted and used in this Phase-2 activity to evaluate the developed switches for temperature differentials ranging up to 200 K. Problems encountered at the maximum levels are described and analyzed, and means of avoiding the problems in the future are presented. A comprehensive summary of the overall heat-switch design methodology is also presented with special emphasis on lessons learned over the course of the 4-year development effort

Reliability physics

Speakers whose topics relate to the reliability physics of solar arrays are listed and their topics briefly reviewed. Nine reports are reviewed ranging in subjects from studies of photothermal degradation in encapsulants and polymerizable ultraviolet stabilizers to interface bonding stability to electrochemical degradation of photovoltaic modules

Flat-plate solar array project. Volume 6: Engineering sciences and reliability

The Flat-Plate Solar Array (FSA) Project activities directed at developing the engineering technology base required to achieve modules that meet the functional, safety, and reliability requirements of large scale terrestrial photovoltaic systems applications are reported. These activities included: (1) development of functional, safety, and reliability requirements for such applications; (2) development of the engineering analytical approaches, test techniques, and design solutions required to meet the requirements; (3) synthesis and procurement of candidate designs for test and evaluation; and (4) performance of extensive testing, evaluation, and failure analysis of define design shortfalls and, thus, areas requiring additional research and development. A summary of the approach and technical outcome of these activities are provided along with a complete bibliography of the published documentation covering the detailed accomplishments and technologies developed

Interconnect fatigue design for terrestrial photovoltaic modules

The results of comprehensive investigation of interconnect fatigue that has led to the definition of useful reliability-design and life-prediction algorithms are presented. Experimental data indicate that the classical strain-cycle (fatigue) curve for the interconnect material is a good model of mean interconnect fatigue performance, but it fails to account for the broad statistical scatter, which is critical to reliability prediction. To fill this shortcoming the classical fatigue curve is combined with experimental cumulative interconnect failure rate data to yield statistical fatigue curves (having failure probability as a parameter) which enable (1) the prediction of cumulative interconnect failures during the design life of an array field, and (2) the unambiguous--ie., quantitative--interpretation of data from field-service qualification (accelerated thermal cycling) tests. Optimal interconnect cost-reliability design algorithms are derived based on minimizing the cost of energy over the design life of the array field